Specification: Diamond height 8MM,Diamond Grain #50/70
Diameter 8"/200MM, 10"/250MM,Bore 25.4MM with a 16mm reducer,Segment thickness 1.6MM.
Diameter 12"/300MM, Bore 25.4MM,Segment thickness 2.2MM
Diameter 14"/350MM, Bore 25.4MM, Diamond height 8MM, Segment thickness 2.2MM,Diamond Grain #50/70
Porcelain Tile Ceramic marble stone ect.
Recommend for wet cutting, and available for short time dry cutting
High quality #50/70 diamond grain and continue design segments provide low chip cutting performance.
Hot pressed technology ensure long working life
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