Specification: Segment height 8mm
Diameter 115mm/4.5",segments thickness 1.4mm,bore: 22.23mm
efficient in ceramic/tile, marble，hard material cutting
Wet cutting, and available for short time dry cutting
Continue Rim segments and Thin design of kerf provides chip-free cutting
Hot-press technology much better than cold press production procedure.
High quality diamond grain and strong bond provide long working life and high effieciency
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